| PART |
Description |
Maker |
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| PM1CB1 |
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| PM2SL1 |
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| SOD-123FL |
Package Dimensions
|
Galaxy Semi-Conductor H...
|
| I2PAK |
I2PAK Package Dimensions
|
FAIRCHILD[Fairchild Semiconductor]
|
| SOT-89-3L |
PACKAGE OUTLINE DIMENSIONS
|
ETC
|
| DO-201AE |
DO-201AE PACKAGE DIMENSIONS DO - 201AE包装尺寸
|
Fairchild Semiconductor, Corp.
Fairchild Semiconductor Corporation
FAIRCHILD[Fairchild Semiconductor]
|
| HT-210UDUYG HT-210USDNB HT-210SDYG HT-210YYG HT-21 |
Package Outline Dimensions
Package Outline Dimensions
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
